• 0 Posts
  • 6 Comments
Joined 10 months ago
cake
Cake day: October 11th, 2025

help-circle
  • Intel actually already tried that before back then on Lunar Lake, with for example Core Ultra 200V which comes with 2 LPDDR5X dies integrated directly into the CPU package, which back then allowed for up to 32GB of onboard RAM capacity. This was intended for ultra-portable devices like x86 tablets and embedded systems where the motherboard needs to be as small as possible, and the specific CPU model had a corresponding power and performance envelope for that use case. For that kind of devices this actually made sense.

    Back in 2024 before the AI industry drove up the prices, Intel concluded that this wasn’t worth it because Intel had to purchase those RAM dies at a higher unit price than OEMs who specifically make RAM sticks and thus order RAM chips at much higher volume, in order to package onto their CPU packages themselves.

    Guess they are changing their mind and bringing that back, for a completely different reasoning lol



  • There are about 1.5 billion of total cars + buses + trucks in this world. Even if we assume only 1 billion of them are consumer cars (which is already a VERY conservative estimate), all of them combined make 12% impact, so that schmuck driving a Toyota Corella would contribute less than 0.000000012% of the global climate change.

    Significant my ass.

    Climate change is a phenomenon happening on planetary scale, so the impact of individuals are always going to be astronomically small. This is a crisis that requires nation-state or mega-corp scale of efforts, and blaming individuals for the failure of nation-states and mega-corps on what they should be held responsible for, is extremely disingenuous.


  • It will never lighten the demand because the speed they are building new data centers is always going to be faster than any DRAM manufacturer can ramp up production rate on their existing production line or building new production line. Building data centers is always easier than making DRAM chips in a fab because of the complete different level of technological sophistication.

    This can only help reduce the rate which the demand sprints further and further ahead than supply, but ultimately the only thing that can stop the demand from further increasing exponentially so that DRAM supply could catch up and start to lower down the price is for the whole generative AI industry (among other things) to implode so they don’t all race against each other building new data centers anymore.

    And we can already see that new consumer DDR5 RAM boards and consumer products using the Chinese CXMT DRAM chips (such as some of the recent Lenovo ThinkPad laptops) are not one cent cheaper than similar spec’ed products using non-Chinese DRAM chips, in fact some are even $100-200 more expensive, probably because the scale of supply chain is still lagging behind for them because the Chinese DRAM chips with modern specs only became available in the market relatively recently.


  • Exactly this! As someone who owns a Sony Xperia 1 VI, it’s worth pointing out too that Sony managed to achieve this level of waterproof with a tool-less SIM/SD card tray too, which you can simply pull out the card tray with your finger, without having to use a pin. Sony likely chose this design because they wanted to market the Xperia phones to photography enthusiasts (as can be seen in their marketing), so they wanted make it quick and simple to swap the SD card between the phone and a PC for transferring photos, like when you’re using a proper DLSR camera. And they’ve been using this tool-less tray design since the 2nd gen model that came out 6 years ago, it’s a proven reliable design.

    So yeah waterproofing a phone really wasn’t as hard as some of those manufecturers tried to suggest.

    There are many other companies who made waterproof phones with replaceable battery too with good IP rating.it was never a technology problem.